JPH0756174Y2 - 樹脂モールド装置 - Google Patents
樹脂モールド装置Info
- Publication number
- JPH0756174Y2 JPH0756174Y2 JP7760390U JP7760390U JPH0756174Y2 JP H0756174 Y2 JPH0756174 Y2 JP H0756174Y2 JP 7760390 U JP7760390 U JP 7760390U JP 7760390 U JP7760390 U JP 7760390U JP H0756174 Y2 JPH0756174 Y2 JP H0756174Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- crushing block
- resin
- resin molding
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 23
- 229920005989 resin Polymers 0.000 title claims description 23
- 238000000465 moulding Methods 0.000 title claims description 11
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 230000010485 coping Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7760390U JPH0756174Y2 (ja) | 1990-07-20 | 1990-07-20 | 樹脂モールド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7760390U JPH0756174Y2 (ja) | 1990-07-20 | 1990-07-20 | 樹脂モールド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0437313U JPH0437313U (en]) | 1992-03-30 |
| JPH0756174Y2 true JPH0756174Y2 (ja) | 1995-12-25 |
Family
ID=31620146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7760390U Expired - Lifetime JPH0756174Y2 (ja) | 1990-07-20 | 1990-07-20 | 樹脂モールド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0756174Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6873008B2 (ja) * | 2017-08-18 | 2021-05-19 | ニチコン株式会社 | ケースレスフィルムコンデンサの製造方法 |
-
1990
- 1990-07-20 JP JP7760390U patent/JPH0756174Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0437313U (en]) | 1992-03-30 |
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